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This report analyzes electronic packaging trends and evolutionary changes that influence high-speed board-to-board connector designs. It explains what connector families best fit architectures including medical, industrial, mil-aero, server racks, switches, large routers, standard card cages and 1U boxes. Mezzanine connector standards are also explained allowing readers to find the connector and standard that best fits their application.
Connector product managers, design engineers, procurement teams, and financial analysts will all find valuable information in this report enabling them to develop winning strategic plans for their products and companies. OEM management, design and procurement can use the information in this report to make knowledgeable decisions about architectural and interconnect strategies most likely to give them a competitive advantage in their markets. Tables in the report show what stack heights and pin counts are available for various configurations and signal integrity requirements.
This report focuses on high-speed mezzanine, edge cards, memory, and storage connectors designed for data rates from 10 to 56Gbps. Offerings from all the major high-speed board-to-board connector suppliers are described, compared, and contrasted, allowing readers to quickly identify the right connector families and suppliers most likely to meet their specific needs for mechanical and electrical performance.
This report excludes some categories not considered important enough, and different enough, to warrant their own deep dive. Not included in this report are backplane connectors, power, cable solutions, flex circuit connectors, and fiber optic systems. Microminiature connectors, such as those used in laptops and phones, are also excluded.
Fundamental strategies, range of offerings, and direction is explained for each supplier. It becomes easy to see how connector manufacturers collaborate, compete, and differentiate themselves from competitors.
As data rates reach beyond 56Gbps, connector designs need to be finely tuned for tight impedance control and reduced crosstalk. This report illuminates how the highest speed connectors are able to achieve these data rates while still maintaining high density and robust construction.
Market size and forecast data are provided by connector types including:
Open pin field mezzanines
Stripline dual row connectors
Backplane style mezzanine connectors
High-speed edge card connectors
Financial firms seeking investment opportunities in the connector space will benefit from the insight provided in this report regarding market attractiveness, competitive positioning and important market trends that will drive future growth.
This report is also a great tutorial about the range of connector options available from major manufacturers, the strengths and limitations of various systems and technology, and second sourcing strategy. This information combined with informative tables showing what stack heights, configurations, pin counts, and data rates are available from the various families provides guidance for OEM design and procurement people, as well as distributor sales people and product managers, who need to guide their customers to the best interconnect for each application.
A family of printed circuit board connectors (PCB) that have evolved significantly over the last decade, high-speed board-to-board connectors have entered into design areas few would have thought possible just a few years ago. Couple this with the number of pin and height variations required to satisfy the needs of the various system developers and the design parameters can become daunting! This report analyses those parameters, and provides an overview of both existing and newly developed products, allowing the reader to intelligently categorize and quantify the market for high-speed board-to-board connectors.
Table of Contents
Chapter 1 – Report Overview and Definition of Terms
Scope of the Study
Chapter 2 – Executive Summary
Why Have Connectors at All?
2U, 4U Packaging
VITA – VME International Trade Association
PICMG – PCI Industrial Computer Manufacturers Group
Open Compute Open Rack Architecture
OpenCloud Connector Specifications
Storage Box Architectures
Mating Multiple Connectors at Once
Chapter 3 – Discussion of Connector Types
Two Row Open Pin Field Connectors
Vertical Plug and Receptacle Using Blanked Contacts
Open Pin Field Array Connectors
Pin in Hole Reflow (PIHR) Connectors
Press Fit Connectors
Wafer Style Connectors
Screw Machine Connectors
Right Angle to Right Angle Connectors to Connect Coplanar Boards
Vertical Edge Card Connectors
SAS (Serial Attached SCSI)
SATA (Serial ATA)
Chapter 4 – Industry Standards
IEC – International Electrotechnical Commission
ANSI – American National Standards Institute
IEEE – Institute for Electrical and Electronic Engineers
MicroTCA MCH Plug Solutions
COM Express® Modules
VITA – VME International Trade Association
VITA 42 XMC Connector
VITA 57 FMC Connector
VITA 61 Rugged XMC Connector
PCI Express Mini Card
PISMO™ Platform Independent Storage
Chapter 5 – High-Speed Board-to-Board Connector Supplier Profiles
TE Mictor SB
TE STRADA Mesa
TE HM ZD Mezzanine
Samtec Q2™ Shielded
Samtec Edge Rate™ Connectors
Samtec High Speed Edge Card Connectors (HSEC)
Samtec Razor Beam™ System
Samtec Q Rate™
Samtec SEARAY Connector
Samtec Z-Ray® Interposers
Amphenol High-Speed Edge-27
Amphenol-TCS VHDM® Stacker
Molex/Samtec HD MEZZ™
Molex NeoScale® High-Speed Mezzanine
Molex NeoPress® High-Speed Mezzanine
Molex HS Dock+™ System
Molex Edgeline® 25
Molex Impact Stacker
Hirose IT5/Samtec SkyRay
Hirose FX18 RA/Coplanar
Amphenol FCI Meg-Array®
Amphenol FCI Gig-Array®
Amphenol FCI TwinMezz®
Amphenol FCI ExaMezz®
JST JMD Connector
JST JMC Connector
JST Vertical SO DIMM 144
Advanced Interconnect B2B® Mezzanine
HARTING AMC Plug
Yamaichi AMC and MicroTCA Compression
Fujitsu Differential Connector
Chapter 6 – Observations and Conclusions
Observations and Conclusions
Chapter 7 – Statistical Analysis
High-Speed Mezzanine Connectors by Connector Type and Region 2014 and 2015 with Percent Change
Storage Connectors by Product Type and Region 2014 and 2015 with Percent Change
DIMM Modules by Type and Region 2014 and 2015 with Percent Change
High-Speed Mezzanine Connectors by Connector Type and Region 2015 and 2016F with Percent Change
Storage Connectors by Product Type and Region 2015 and 2016F with Percent Change
DIMM Modules by Type and Region 2015 and 2016F with Percent Change
High-Speed Mezzanine Connectors by Connector Type and Region 2016F and 2021F with 5-Year CAGR
2016F High-Speed Mezzanine Connectors by Region
2021F High-Speed Mezzanine Connectors by Region
High-Speed Mezzanine Connectors by Type 5-Year CAGR 2016F to 2021F
Storage Connectors by Product Type and Region 2016F and 2021F with Percent Change
2016F Storage Connectors by Region
2021F Storage Connectors by Region
DIMM Modules by Type and Region
2016F DIMM Modules by Region
2021F DIMM Modules by Region
Appendix A – Terms and Definitions
Appendix B – Connector Speeds and Multiple Sourcing
Appendix C – Stack Heights Available by Connector Family
Appendix D – Connector Families Based on Bishop Category
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