High-Speed Board-to-Board Connectors

Code: P-890-16 | Published: Aug-2016 | Pages: 215 | Bishop & Associates Inc
Price :

* Required Fields



Bishop and Associates Inc. announces the release of a new seven-chapter, 215-page research report analyzing High-Speed Board-to-Board Connectors.

This report analyzes electronic packaging trends and evolutionary changes that influence high-speed board-to-board connector designs. It explains what connector families best fit architectures including medical, industrial, mil-aero, server racks, switches, large routers, standard card cages and 1U boxes. Mezzanine connector standards are also explained allowing readers to find the connector and standard that best fits their application.

Connector product managers, design engineers, procurement teams, and financial analysts will all find valuable information in this report enabling them to develop winning strategic plans for their products and companies. OEM management, design and procurement can use the information in this report to make knowledgeable decisions about architectural and interconnect strategies most likely to give them a competitive advantage in their markets. Tables in the report show what stack heights and pin counts are available for various configurations and signal integrity requirements.

This report focuses on high-speed mezzanine, edge cards, memory, and storage connectors designed for data rates from 10 to 56Gbps. Offerings from all the major high-speed board-to-board connector suppliers are described, compared, and contrasted, allowing readers to quickly identify the right connector families and suppliers most likely to meet their specific needs for mechanical and electrical performance.

This report excludes some categories not considered important enough, and different enough, to warrant their own deep dive. Not included in this report are backplane connectors, power, cable solutions, flex circuit connectors, and fiber optic systems. Microminiature connectors, such as those used in laptops and phones, are also excluded.

Fundamental strategies, range of offerings, and direction is explained for each supplier. It becomes easy to see how connector manufacturers collaborate, compete, and differentiate themselves from competitors.

As data rates reach beyond 56Gbps, connector designs need to be finely tuned for tight impedance control and reduced crosstalk. This report illuminates how the highest speed connectors are able to achieve these data rates while still maintaining high density and robust construction.

Market size and forecast data are provided by connector types including:

Open pin field mezzanines
Stripline dual row connectors
Drive connectors
Backplane style mezzanine connectors
High-speed edge card connectors
Memory sockets
Financial firms seeking investment opportunities in the connector space will benefit from the insight provided in this report regarding market attractiveness, competitive positioning and important market trends that will drive future growth.

This report is also a great tutorial about the range of connector options available from major manufacturers, the strengths and limitations of various systems and technology, and second sourcing strategy. This information combined with informative tables showing what stack heights, configurations, pin counts, and data rates are available from the various families provides guidance for OEM design and procurement people, as well as distributor sales people and product managers, who need to guide their customers to the best interconnect for each application.

A family of printed circuit board connectors (PCB) that have evolved significantly over the last decade, high-speed board-to-board connectors have entered into design areas few would have thought possible just a few years ago. Couple this with the number of pin and height variations required to satisfy the needs of the various system developers and the design parameters can become daunting! This report analyses those parameters, and provides an overview of both existing and newly developed products, allowing the reader to intelligently categorize and quantify the market for high-speed board-to-board connectors.

Table of Contents

Chapter 1 – Report Overview and Definition of Terms

Scope of the Study

Chapter 2 – Executive Summary

Why Have Connectors at All?
19”Rack Architecture
2U, 4U Packaging
9U Sub-Racks
VITA – VME International Trade Association
PICMG – PCI Industrial Computer Manufacturers Group
Open Compute Open Rack Architecture
OpenCloud Connector Specifications
Storage Box Architectures
Mating Multiple Connectors at Once

Chapter 3 – Discussion of Connector Types

Two Row Open Pin Field Connectors
Vertical Plug and Receptacle Using Blanked Contacts
Array Connectors
Open Pin Field Array Connectors
Pin in Hole Reflow (PIHR) Connectors
Press Fit Connectors
Wafer Style Connectors
Screw Machine Connectors
Right Angle to Right Angle Connectors to Connect Coplanar Boards
Vertical Edge Card Connectors
Riser Cards
Pluggable Modules
Memory Connectors
Angled DIMM
Storage Connectors
SAS (Serial Attached SCSI)
SATA (Serial ATA)
Micro SATA
Slimline SATA

Chapter 4 – Industry Standards

IEC – International Electrotechnical Commission
ANSI – American National Standards Institute
IEEE – Institute for Electrical and Electronic Engineers
AdvancedMC™ (AMC)
MicroTCA MCH Plug Solutions
COM Express® Modules
VITA – VME International Trade Association
VITA 42 XMC Connector
VITA 57 FMC Connector
VITA 61 Rugged XMC Connector
PCI Express®
PCI Express Mini Card
MXM 3.0
PISMO™ Platform Independent Storage

Chapter 5 – High-Speed Board-to-Board Connector Supplier Profiles

TE Connectivity
TE Mictor
TE Mictor SB
TE Mezalok
TE HM ZD Mezzanine
Samec Q-Strip®
Samtec Q2™ Shielded
Samtec Edge Rate™ Connectors
Samtec High Speed Edge Card Connectors (HSEC)
Samtec Razor Beam™ System
Samtec Q Rate™
Samtec SamArray®
Samtec SEARAY Connector
Samtec Z-Ray® Interposers
Samtec SkyRay™
Amphenol-TCS Strategy
Amphenol-TCS NeXLev®
Amphenol-TCS InfinX™
Amphenol-TCS XCede®
Amphenol-TCS Paladin®
Amphenol High-Speed Edge-27
Amphenol Lynx
Amphenol-TCS Aptera™
Amphenol-TCS VHDM® Stacker
Molex/Samtec SEARAY
Molex/Samtec HD MEZZ™
Molex NeoScale® High-Speed Mezzanine
Molex NeoPress® High-Speed Mezzanine
Molex HS Dock+™ System
Molex SpeedStack™
Molex Edgeline®
Molex Edgeline® 25
Molex CoEdge
Molex Impact Stacker
Hirose Strategy
Hirose FX10
Hirose FX11
Hirose FX12
Hirose IT3
Hirose IT5/Samtec SkyRay
Hirose XG1
Hirose FX18 RA/Coplanar
Amphenol FCI
Amphenol FCI Meg-Array®
Amphenol FCI Gig-Array®
Amphenol FCI TwinMezz®
Amphenol FCI ExaMezz®
JST JMD Connector
JST JMC Connector
JST Vertical SO DIMM 144
Advanced Interconnect
Advanced Interconnect B2B® Mezzanine
HARTING con:card+®
Yamaichi AMC and MicroTCA Compression
ERNI MicroSpeed®
Fujitsu Differential Connector

Chapter 6 – Observations and Conclusions

Observations and Conclusions

Chapter 7 – Statistical Analysis

High-Speed Mezzanine Connectors by Connector Type and Region 2014 and 2015 with Percent Change
Storage Connectors by Product Type and Region 2014 and 2015 with Percent Change
DIMM Modules by Type and Region 2014 and 2015 with Percent Change
High-Speed Mezzanine Connectors by Connector Type and Region 2015 and 2016F with Percent Change
Storage Connectors by Product Type and Region 2015 and 2016F with Percent Change
DIMM Modules by Type and Region 2015 and 2016F with Percent Change
High-Speed Mezzanine Connectors by Connector Type and Region 2016F and 2021F with 5-Year CAGR
2016F High-Speed Mezzanine Connectors by Region
2021F High-Speed Mezzanine Connectors by Region
High-Speed Mezzanine Connectors by Type 5-Year CAGR 2016F to 2021F
Storage Connectors by Product Type and Region 2016F and 2021F with Percent Change
2016F Storage Connectors by Region
2021F Storage Connectors by Region
DIMM Modules by Type and Region
2016F DIMM Modules by Region
2021F DIMM Modules by Region
Appendix A – Terms and Definitions
Appendix B – Connector Speeds and Multiple Sourcing
Appendix C – Stack Heights Available by Connector Family
Appendix D – Connector Families Based on Bishop Category

Report Format

Following are different modes of Licenses.

a. Single User License:
This license allows only one person to use the report. This person can use the report on any computer and may take print outs of the report but must take care of not sharing the report (or any information contained therein) with any other individual or people. Unless you purchase a Site License or a Global Site License, a Single User License must be purchased for every single person that wishes to use the report within the same enterprise.

b. Single Site License:
This license allows unlimited users to use the report within one company location, e.g. a regional office. These users can use the report on any computer and may take print outs of the report but must take care of not sharing the report (or any information contained therein) with any other individual or people.

c. Global Site License:
A Global Site License (or Enterprise wide Site License or Global License) is a license granted to original purchaser, who can share a report with other employees and authorized Users of the same organization.

Quick Help

1. How do you deliver the reports?
The delivery of reports is depends on format & mode of license of report(s). Following are different kinds of formats of report(s) and their delivery options :

a. Electronic Format – Through email from Publisher
Report will be sent to your username email address in PDF, Excel, PowerPoint or any other electronic / softcopy format by publisher.
Delivery Time: 12 to 48 hours [depending on time difference or occurrences of national holidays]

b. Hard Copy or Printed Format or CD-Rom – Through Mail or Courier from Publisher
Report will be sent through mail / courier delivery to your shipping address by publisher.
Delivery Time: Less than, few weeks [depending on time difference or occurrences of national holidays]

2. How can I make payment for publications I purchase?
You could be able to make the payment, in following ways:

a. Online Secure Payment through Credit Card Payment : We accept Visa, Master, AMEX Cards & CCAvenue
b. Transfer of fund to our bank account via Bank transfer or Wire transfer
c. Payment via DD or Cheque
d. Paypal

3. Is it safe to use my credit card on MarketinfoResearch?
Your personal information and online tranaction on Marketinfo Research is secure, private, and tamper-proof. All credit card payments are processed through secure and trusted payment gateways.

If you have a more question about our publications please see our FAQs section or contact us now at cs@marketinforesearch.com.


There are no reports matching the selection.

Browse similar reports by category:
Computer, Hardware & Networking
Bishop & Associates Inc

Our Clients